Total investment
approx. 1 billion euros
Site
approx. 100,000 m2
Total floor space
approx. 72,000 m2 of production area and office space
Clean-room area
Currently approx. 10,000 m²,
addition of some 3,000 m²
Associates
roughly 480 in August 2023
Qualified professionals needed
Experts from the semiconductor industry, such as process, production or maintenance engineers, mathematicians, software engineers as well as professionals and graduates with degrees in physics, chemistry, or microsystems technology
Manufactoring technology
Highly automated wafer production (300mm silicon substrate wafers with structures up to 65nm in width)
Manufactured products
Application-specific integrated circuits (ASICs) and power semiconductors
MEMS manufactoring on 300mm
wafers (SOP in 2026)
Fields of application for semiconductors
Mainly automotive electronics and industrial applications
Connected manufactoring
At the wafer fab in Dresden, production data is generated at a rate of 250 MB/second, which corresponds to the data volume of 400 HD videos running simultaneously.
Funding
Construction of the new wafer fab in Dresden received funding as part of IPCEI 1 Microeletronics (Important Project of Common European Interest) from the German federal government – more specifically, the Federal Ministgry for Economic Affairs and Climate Action (BMWK).
Over the next years, Bosch plans to invest some three billion euros in Dresden and Reutlingen, both as part of its own investment plan and under the auspices of the European IPCEI ME (“Important Project of Common European Interest on Microelectronics”) funding program.
